Product specification
16
20
General Purpose & High Cap.
X7R
6.3 V to 50 V
Surface-Mount Ceramic Multilayer Capacitors
TEST
TEST METHOD PROCEDURE
IEC 60384- 4.6 Class 2:
REQUIREMENTS
<General Purpose series>
Temperature
Characteristic
21/22
∆C/C
Between minimum and maximum temperature
X7R: -55 °C to +125 °C
Class 2:
X7R: ±15%
Normal Temperature: 20 °C
<High Capacitance series>
∆C/C
Class 2:
X7R: ±15%
4.7
4.8
A force applied for 10 seconds to the line joining the
terminations and in a plane parallel to the substrate
Force
Adhesion
size ≥ 0603: 5N
size = 0402: 2.5N
size = 0201: 1N
Mounting in accordance with IEC 60384-22 paragraph
4.3
No visible damage
Bond Strength
of Plating on
End Face
<General Purpose series>
∆C/C
Conditions: bending 1 mm at a rate of 1 mm/s, radius jig
340 mm
Class2:
X7R: ±10%
<High Capacitance series>
∆C/C
Class2:
X7R: ±10%
4.9
Precondition: 150 +0/–10 °C for 1 hour, then keep for
24 ±1 hours at room temperature
Dissolution of the end face plating shall
not exceed 25% of the length of the
edge concerned
Resistance to
Soldering Heat
Preheating: for size ≤ 1206: 120 °C to 150 °C for 1
minute
Preheating: for size >1206: 100 °C to 120 °C for 1
minute and 170 °C to 200 °C for 1 minute
<General Purpose series>
∆C/C
Solder bath temperature: 260 ±5 °C
Dipping time: 10 ±0.5 seconds
Recovery time: 24 ±2 hours
Class2:
X7R: ±10%
<High Capacitance series>
∆C/C
Class2:
X7R: ±10%
D.F. within initial specified value
Rins within initial specified value
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Oct 13, 2011 V.8