DDR2-400, 533
Single Rank, x8 Registered SDRAM DIMMs
IDD Specifications and Conditions (512MB - 64Mx8, 9 components):
Symbol
DRAM IC
-5
-3.75
Units
Parameter
Manufacturer*
DDR2-400
DDR2-533
IDD0
Operating Current
MT
INF
SAM
MT
TBD
745
TBD
918
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
1265
TBD
790
1420
TBD
1008
1540
TBD
369
IDD1
Operating Current
INF
SAM
MT
1330
TBD
286
IDD2P
IDD2Q
IDD2N
IDD3P
Precharge Power-Down Current
Precharge Quiet Standby Current
Precharge Standby Current
INF
SAM
MT
495
535
TBD
475
TBD
603
INF
SAM
MT
665
715
TBD
538
TBD
639
INF
SAM
MT
670
730
Active Power-Down Standby Current
MRS(12) = 0
TBD
367
TBD
477
INF
SAM
MT
720
750
Active Power-Down Standby Current
MRS(12) = 1
TBD
295
TBD
378
INF
SAM
MT
365
375
IDD3N
IDD4W
IDD4R
IDD5B
IDD6
Active Standby Current
Operating Current Burst Write
Operating Current Burst Read
Burst Auto-Refresh Current
Self Refresh Current
TBD
565
TBD
693
INF
SAM
MT
1065
TBD
925
1180
TBD
1188
2340
TBD
1143
2020
TBD
1503
2275
TBD
36
INF
SAM
MT
1725
TBD
880
INF
SAM
MT
1655
TBD
1330
2125
TBD
36
INF
SAM
MT
INF
SAM
MT
490
560
IDD7
Operating Current
TBD
1420
3020
TBD
1593
3155
INF
SAM
Note:
DRAM IC Manufacturer* - MT = Micron, INF = Infineon, SAM=Samsung
DDR2_RDIMM_1 rank_x8_spec
Rev. 1.0 - December, 04
Wintec Industries, Inc., reserves the right to change datasheets and/or products without any notice.
2004 Wintec Industries, Inc.
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