R
QPro Virtex 2.5V QML High-Reliability FPGAs
Device/Package Combinations and Maximum I/O
Maximum User I/O (Excluding dedicated clock pins.)
Package
PQ240
HQ240
BG256
BG352
BG432
BG560
CB228
CG560
XQV100
XQV300
XQV600
XQV1000
166
166
-
-
-
-
166
-
180
-
-
-
-
-
316
-
-
316
-
-
-
-
-
162
-
404
-
162
-
162
-
404
Ordering Information
Example:
XQV300 -4 CB 228 M
Device Type
Temperature Range/Grade
Speed Grade(1)
Number of Pins
Package Type
Device Ordering Options
Temperature
Device Type
XQV100
Package
Grade
PQ240 240-pin Plastic Quad Flat Package
HQ240 240-pin High Heat Dissipation QFP Package
BG256 256-ball Plastic BGA Package
BG352 352-ball Plastic BGA Package
BG432 432-ball Plastic BGA Package
BG560 560-ball Plastic BGA Package
Military Ceramic
TC = –55°C to +125°C
M
N
Q
XQV300
Military Plastic
TJ = –55°C to +125°C
MIL-PRF-38535(2) TC = –55°C to +125°C
XQV600
XQV1000
CB228
228-pin Ceramic Quad Flat Package
CG560 560-column Ceramic Column Grid Package
Notes:
1. -4 only supported speed grade.
2. Class Q must be ordered with SMD number.
Valid Ordering Combinations
M Grade
N Grade
XQV100-4PQ240N
XQV100-4CB228M
XQV300-4CB228M
XQV600-4CB228M
XQV1000-4CG560M
XQV300-4BG432N
XQV600-4HQ240N
XQV600-4BG432N
XQV1000-4BG560N
XQV100-4BG256N
XQV300-4PQ240N
XQV300-4BG352N
30
www.xilinx.com
DS002 (v1.5) December 5, 2001
1-800-255-7778
Preliminary Product Specification
XILINX [ XILINX, INC ]
