R
QPro Virtex 2.5V QML High-Reliability FPGAs
SMD (Class Q) Odering Options
5962 9957201 Q Y C
Generic Standard
Microcircuit Drawing (SMD)
Lead Finish
Package Type
QML Certified MIL-PRF-38535(1)
Device Type
Valid SMD Combinations
SMD Number
Device
Pkg Markings
Lead Finish
Gold Plate
5962-9957201QYC
5962-9957201QZC
5962-9957201NTB
5962-9957201NNA
5962-9957201NUA
5962-9957301QYC
5962-9957301QZC
5962-9957301NTB
5962-9957301NUA
5962-9957401QXC
5962-9957401NUA
XQV300-4CB228Q
XQV300-4CB228Q
XQV300-4PQ240N
XQV300-4BG352N
XQV300-4BG432N
XQV600-4CB228Q
XQV600-4CB228Q
XQV600-4HQ240N
XQV600-4BG432N
XQV1000-4CG560Q
XQV1000-4BG560N
Lid
Base
Gold Plate
-
Solder Plate
Solder Ball
Solder Ball
Gold Plate
-
-
Lid
Base
Gold Plate
-
-
-
-
Solder Plate
Solder Ball
Solder Column
Solder Ball
Notes:
1. Type N designates QML Plastic.
Revision History
The following table shows the revision history for this document
Date
Version
1.0
Revision
10/04/99
06/01/00
02/13/01
11/05/01
11/15/01
12/05/01
Initial Xilinx release.
1.1
Upated format.
1.2
Updated Temperature Specifications.
1.3
Changed V600 Power-up temp min to –55°C. Added L33 as Bank 7 VREF. Updated format.
Fixed boken links. Added note for VCCO banking rules for PQ240 package.
Corrected Table 5 pin description for pin 9 and pin 39.
1.4
1.5
DS002 (v1.5) December 5, 2001
www.xilinx.com
31
Preliminary Product Specification
1-800-255-7778
XILINX [ XILINX, INC ]
