R
QPro Series Configuration PROMs (XQ) including Radiation-Hardened Series (XQR)
Ordering Information
XQR1701L CC44 V
Device Number
Grade (Manufacturing Flow/ Temperature
Range)
Package Type
Device Ordering Options
Device Type
Package
Grade
CC44
SO20
44-pin Ceramic Chip Carrier Package
Military Ceramic
Military Plastic
QPro-Plus
T = –55°C to +125°C
C
XQ1701L
M
N
V
(1)
20-column Plastic Small Outline Package
T = –55°C to +125°C
J
XQR1701L
T
= –55°C to +125°C
C
Notes:
1. Radiation Hardened.
5962 9951401 Q Y A
Generic Standard Microcir-
cuit Drawing (SMD)
Lead Finish
Package Type
QML Certified MIL-PRF-38535
Device Type
SMD Ordering Options
Package
Device Type
QML
QYA
NXB
Lead Finish
Solder Dip
Solder Plate
9951401
-
XQ1701L
44-pin Ceramic Chip Carrier Package
20-column Plastic Small Outline Package
XQR1701L
Valid Ordering Combinations
Mil-Std
SMD
Rad Hard
SMD
XQR1701LCC44M
XQR1701LCC44V
XQ1701LCC44M
XQ1701LSO20N
5962-9951401QYA
5962-9951401NXB
-
10
www.xilinx.com
DS062 (v3.1) November 5, 2001
1-800-255-7778
Preliminary Product Specification
XILINX [ XILINX, INC ]
