XC3000 Logic Cell Array Family
Xilinx maintains test specifications for each product as controlled documents. To insure the use of the most recently
released device performance parameters, please request a copy of the current test-specification revision.
Absolute Maximum Ratings
Symbol Description
V
CC
V
IN
V
TS
T
STG
T
SOL
Supply voltage relative to GND
Input voltage with respect to GND
Voltage applied to 3-state output
Storage temperature (ambient)
Maximum soldering temperature (10 s @ 1/16 in.)
Junction temperature plastic
T
J
Junction temperature ceramic
+150
–0.5 to +7.0
–0.5 to V
CC
+0.5
–0.5 to V
CC
+0.5
–65 to +150
+260
+125
Units
V
V
V
°C
°C
°C
°C
Note: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those listed under Recommended Operating Conditions is not implied. Exposure to Absolute Maximum
Ratings conditions for extended periods of time may affect device reliability.
Operating Conditions
Symbol
V
CC
Description
Supply voltage relative to GND Commercial 0°C to +85°C junction
Supply voltage relative to GND Industrial -40°C to +100°C junction
V
IHT
V
ILT
V
IHC
V
ILC
T
IN
High-level input voltage — TTL configuration
Low-level input voltage — TTL configuration
High-level input voltage — CMOS configuration
Low-level input voltage — CMOS configuration
Input signal transition time
Min
4.75
4.5
2.0
0
70%
0
Max
5.25
5.5
V
CC
0.8
100%
20%
250
Units
V
V
V
V
V
CC
V
CC
ns
At junction temperatures above those listed as Operating Conditions, all delay parameters increase by 0.3% per
°C.
2-154
XILINX [ XILINX, INC ]
