X9279
16-Bump Chip Scale Package (CSP B16)
Package Outline Drawing
a
d
f
A4
A3
A2
A1
B4
C4
D4
B3
C3
D3
B2
C2
D2
k
B1
C1
D1
b
j
m
l
e
Top View (Marking Side)
Bottom View (Bumped Side)
Side View
e
c
Side View
Package Dimensions
Ball Matrix:
Millimeters
4
3
2
1
Symbol
Min
Nominal
2.623
2.801
0.677
0.457
0.220
0.320
0.5
Max
R
R
A
A0
Vcc
L
H
Package Width
a
b
c
d
e
f
2.593
2.771
0.644
0.444
0.200
0.300
2.653
2.831
0.710
0.470
0.240
0.340
R
B
C
D
A2
NC
NC
Vss
NC
NC
WP
W
Package Length
SCL
SDA
A3
A1
Package Height
Body Thickness
Ball Height
Ball Diameter
Ball Pitch – Width
Ball Pitch – Length
Ball to Edge Spacing – Width
Ball to Edge Spacing – Length
j
k
l
0.5
0.537
0.626
0.562
0.651
0.587
0.676
m
Characteristics subject to change without notice. 23 of 24
REV 1.1.7 2/6/03
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