X9250
PACKAGING INFORMATION
24-Bump Chip Scale Package (CSP B24)
Package Outline Drawing
d
a
f
A2
B2
C2
D2
A3
A4
B4
A1
B1
C1
B3
C3
C4
j
b
D3
E3
F3
D4
E4
F4
D1
E2
F2
E1
F1
m
l
k
e
Side View
Bottom View (Bumped Side)
Top View (Sample Marking)
e
c
Side View
Package Dimensions
Ball Matrix:
Millimeters
4
3
2
1
Symbol
Min
Nominal
2.801
4.579
0.677
0.457
0.220
0.320
0.5
Max
R
R
R
W0
A
B
C
D
E
F
A1
SI
CS
WP
L1
Package Width
a
b
c
d
e
f
2.771
4.549
0.644
0.444
0.200
0.300
2.831
4.609
0.710
0.470
0.240
0.340
R
W1
L0
Package Length
R
R
VSS
VCC
V+
H1
H0
Package Height
R
V-
RH2
HOLD
SCK
H3
Body Thickness
R
R
SO
A0
W2
L3
Ball Height
R
R
L2
W3
Ball Diameter
Ball Pitch – Width
Ball Pitch – Length
Ball to Edge Spacing – Width
Ball to Edge Spacing – Length
j
k
l
0.5
0.626
1.015
0.651
1.040
0.676
1.065
m
Characteristics subject to change without notice. 18 of 21
REV 1.1.5 1/31/03
www.xicor.com
XICOR [ XICOR INC. ]
