X28HC64
PACKAGING INFORMATION
32-PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE TYPE E
0.150 (3.81) BSC
0.020 (0.51) x 45° REF.
0.095 (2.41)
0.075 (1.91)
PIN 1
0.022 (0.56)
0.006 (0.15)
0.055 (1.39)
0.200 (5.08)
BSC
0.045 (1.14)
TYP. (4) PLCS.
0.028 (0.71)
0.040 (1.02) x 45° REF.
0.022 (0.56)
(32) PLCS.
TYP. (3) PLCS.
0.050 (1.27) BSC
0.458 (11.63)
0.442 (11.22)
0.088 (2.24)
0.050 (1.27)
0.458 (11.63)
––
0.300 (7.62)
BSC
0.120 (3.05)
0.060 (1.52)
0.560 (14.22)
0.540 (13.71)
0.558 (14.17)
––
0.400 (10.16)
BSC
PIN 1 INDEX CORDER
NOTE:
1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
2. TOLERANCE: ±1% NLT ±0.005 (0.127)
3926 FHD F14
20
XICOR [ XICOR INC. ]
