欢迎访问ic37.com |
会员登录 免费注册
发布采购

5962-8771202XX 参数 Datasheet PDF下载

5962-8771202XX图片预览
型号: 5962-8771202XX
PDF下载: 下载PDF文件 查看货源
内容描述: [Non-Volatile SRAM, 512X8, 300ns, CMOS, 0.600 INCH, DIP-28]
分类和应用: 静态存储器
文件页数/大小: 15 页 / 384 K
品牌: XICOR [ XICOR INC. ]
 浏览型号5962-8771202XX的Datasheet PDF文件第1页浏览型号5962-8771202XX的Datasheet PDF文件第3页浏览型号5962-8771202XX的Datasheet PDF文件第4页浏览型号5962-8771202XX的Datasheet PDF文件第5页浏览型号5962-8771202XX的Datasheet PDF文件第6页浏览型号5962-8771202XX的Datasheet PDF文件第7页浏览型号5962-8771202XX的Datasheet PDF文件第8页浏览型号5962-8771202XX的Datasheet PDF文件第9页  
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-87712
01
X_
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
Generic number
2004
2004
Circuit function
512 x 8 bit, nonvolatile static RAM
512 x 8 bit, nonvolatile static RAM
Access time
250 ns
300 ns
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Descriptive designator
GDIP1-T28 and CDIP2-T28
CQCC1-N32
Terminals
28
32
Package style
dual-in-line package
rectangular chip carrier package
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Temperature under bias - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
Storage temperature- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
Voltage on any pin with respect to ground - - - - - - - - - - - - - - - - - - - - -
DC output current - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
Lead temperature (soldering, 10 seconds)- - - - - - - - - - - - - - - - - - - - -
Power dissipation (P
D
) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
Thermal resistance, junction-to-case (θ
JC
)- - - - - - - - - - - - - - - - - - - - -
Junction temperature (T
J
) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
1.4 Recommended operating conditions.
Supply voltage (V
CC
) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
Minimum high level input voltage (V
IH
)- - - - - - - - - - - - - - - - - - - - - - - -
Maximum high level input voltage (V
IH
) - - - - - - - - - - - - - - - - - - - - - - -
Minimum low level input voltage (V
IL
) - - - - - - - - - - - - - - - - - - - - - - - -
Maximum low level input voltage (V
IL
) - - - - - - - - - - - - - - - - - - - - - - - -
Case operating temperature range (T
C
) - - - - - - - - - - - - - - - - - - - - - - -
4.5 V dc to 5.5 V dc
+2.3 V dc
+V
CC
+ 0.5 V dc
-0.5 V dc
+0.8 V dc
-55ºC to +125ºC
-65ºC to +135ºC
-65ºC to +150ºC
-1.0 V to +7.0 V dc
5.0 mA
300ºC
0.75 W
See MIL-STD-1835
200ºC
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87712
SHEET
D
2