WPMDH1100601 / 171010601
MagI3C Power Module
VDRM – Variable Step Down Regulator Module
6: Make input and output bus connections as wide as possible
MagI3C Module
PGND
4
5
6
1
3
2
7
GND
VIN
GND
VOUT
CIN1
CIN2
COUT1 COUT2
RON
RENT
CSS
RFBB
CFF
RFBT
Bottom
RENB
GROUND PLANE
This reduces any voltage drops on the input or output of the converter and maximizes efficiency.
7: Provide adequate device heat-sinking
MagI3C Module
PGND
4
5
6
1
3
2
7
GND
VIN
GND
VOUT
CIN1
CIN2
COUT1 COUT2
RON
RENT
CSS
RFBB
CFF
RFBT
Bottom
RENB
GROUND PLANE
Place a dedicated PGND copper area beneath the MagI³C Power Module.
Use an array of heat-sinking vias to connect the PGND pad to the ground plane on the bottom PCB layer. If the PCB has
multiple of copper layers, these thermal vias can also be used to make a connection to the heat-spreading ground planes
located on inner layers.
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Würth Elektronik eiSos GmbH & Co. KG – Data Sheet Rev. 1.0
© September 2017
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