Pre-Production
WM8985
PACKAGE DIAGRAM
FL: 32 PIN QFN PLASTIC PACKAGE 5 X 5 X 0.9 mm BODY, 0.50 mm LEAD PITCH
DM030.E
SEE DETAIL A
D
CORNER
TIE BAR
D2
B
D2/2
5
25
32
L
1
24
INDEX AREA
(D/2 X E/2)
EXPOSED
GROUND
PADDLE
6
E2/2
A
E2
E
SEE DETAIL B
17
8
aaa
C
2 X
16 15
9
b
aaa
C
2 X
B
e
TOP VIEW
DETAIL A
BOTTOM VIEW
ccc
C
CORNER
TIE BAR
(A3)
1
A
1
32x b
B
5
0.08
C
M
A
C
bbb
A1
SIDE VIEW
C
SEATING PLANE
DETAIL B
EXPOSED
GROUND
PADDLE
1
L1
Symbols
Dimensions (mm)
MIN
NOM
0.90
MAX
1.00
0.05
NOTE
A
A1
A3
b
0.85
0
0.02
0.2 REF
0.23
0.18
4.90
3.2
0.30
5.10
3.4
1
2
2
D
5.00
D2
E
3.3
5.00
5.10
3.4
4.90
3.2
E2
e
3.3
0.5 BSC
0.4
L
0.35
0.45
0.1
L1
R
1
b(min)/2
0.20
K
Tolerances of Form and Position
aaa
bbb
ccc
0.15
0.10
0.10
REF:
JEDEC, MO-220, VARIATION VHHD-2
NOTES:
1. DIMENSION b APPLIED TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP. DIMENSION L1 REPRESENTS TERMINAL PULL BACK FROM
PACKAGE SIDE WALL. MAXIMUM OF 0.1mm IS ACCEPTABLE. WHERE TERMINAL PULL BACK EXISTS, ONLY UPPER HALF OF LEAD IS VISIBLE ON PACKAGE SIDE WALL DUE TO HALF
ETCHING OF LEADFRAME.
2. FALLS WITHIN JEDEC, MO-220 WITH THE EXCEPTION OF D2, E2:
D2,E2: LARGER PAD SIZE CHOSEN WHICH IS JUST OUTSIDE JEDEC SPECIFICATION
3. ALL DIMENSIONS ARE IN MILLIMETRES
4. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
5. SHAPE AND SIZE OF CORNER TIE BAR MAY VARY WITH PACKAGE TERMINAL COUNT. CORNER TIE BAR IS CONNECTED TO EXPOSED PAD INTERNALLY.
6. REFER TO APPLICATION NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.
PP, Rev 3.4, October 2006
117
w
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
