Production Data
WM8955BL
PACKAGE DIMENSIONS
FL: 28 PIN COL QFN PLASTIC PACKAGE 4 X 4 X 0.75 mm BODY, 0.45 mm LEAD PITCH
DM043.F
DETAIL 1
D
28
22
21
1
INDEX AREA
(D/2 X E/2)
4
A
E
SEE DETAIL 2
15
7
aaa
C
2 X
8
14
1
aaa
C
2 X
b
M
C
A
B
e
bbb
TOP VIEW
BOTTOM VIEW
ccc
C
DETAIL 1
DETAIL 2
A3
A
L
PIN 1
5
0.08
C
0.275MM
IDENTIFICATION
0.150MM SQUARE
L1
Datum
Terminal
tip
e/2
A1
C
SIDE VIEW
0.275MM
DETAIL 2
SEATING PLANE
e
R
W
T
A3
G
H
b
Exposed lead
DETAIL 2
Dimensions (mm)
Symbols
MIN
NOM
0.75
0.02
MAX
0.775
0.05
NOTE
A
0.725
0
A1
A3
0.203 REF
1
b
0.18
3.95
3.95
0.23
4.00
4.00
0.28
4.05
4.05
D
E
e
0.45 BSC
0.535 REF
G
0.100 REF
0.40 REF
0.05 REF
0.100 REF
0.230 REF
H
L
L1
T
7
W
Tolerances of Form and Position
aaa
0.15
bbb
ccc
0.10
0.10
JEDEC, MO-220
REF:
NOTES:
1. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.15 mm AND 0.30 mm FROM TERMINAL TIP.
2. FALLS WITHIN JEDEC, MO-220, VARIATION VGGD-2.
3. ALL DIMENSIONS ARE IN MILLIMETRES.
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JEDEC 95-1 SPP-002.
5. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
6. REFER TO APPLICATIONS NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.
7. DEPENDING ON THE METHOD OF LEAD TERMINATION AT THE EDGE OF THE PACKAGE, PULL BACK (L1) MAY BE PRESENT.
8. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
PD Rev 4.1 February 2007
43
w
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
