WM8946
Production Data
POWER MANAGEMENT ............................................................................................. 101
THERMAL SHUTDOWN .............................................................................................. 103
POWER ON RESET .................................................................................................... 103
SOFTWARE RESET AND DEVICE ID......................................................................... 105
RECOMMENDED POWER UP / POWER-DOWN SEQUENCES...................... 106
REGISTER MAP................................................................................................ 108
REGISTER BITS BY ADDRESS.................................................................................. 113
DIGITAL FILTER CHARACTERISTICS ............................................................ 163
ADC FILTER RESPONSE............................................................................................ 164
ADC HIGHPASS FILTER RESPONSE........................................................................ 165
DAC FILTER RESPONSE............................................................................................ 166
APPLICATIONS INFORMATION ...................................................................... 168
RECOMMENDED EXTERNAL COMPONENTS.......................................................... 168
AUDIO INPUT PATHS.............................................................................................................................168
HEADPHONE / LINE OUTPUT PATHS ..................................................................................................168
BTL SPEAKER OUTPUT CONNECTION ...............................................................................................169
POWER SUPPLY DECOUPLING ...........................................................................................................169
MICROPHONE BIAS CIRCUIT ...............................................................................................................170
VIDEO BUFFER COMPONENTS............................................................................................................171
RECOMMENDED EXTERNAL COMPONENTS DIAGRAM....................................................................172
PCB LAYOUT CONSIDERATIONS ............................................................................. 172
PACKAGE DIMENSIONS.................................................................................. 173
IMPORTANT NOTICE ....................................................................................... 174
ADDRESS:................................................................................................................... 174
REVISION HISTORY ......................................................................................... 175
PD, July 2012, Rev 4.3
w
4
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
