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WM8945 参数 Datasheet PDF下载

WM8945图片预览
型号: WM8945
PDF下载: 下载PDF文件 查看货源
内容描述: 单声道低功耗编解码器与视频缓冲器和触摸屏控制器 [Mono Low-Power CODEC with Video Buffer and Touch Panel Controller]
分类和应用: 解码器编解码器控制器
文件页数/大小: 169 页 / 1604 K
品牌: WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
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Production Data  
WM8945  
THERMAL PERFORMANCE  
Thermal analysis should be performed in the intended application to prevent the WM8945 from  
exceeding maximum junction temperature. Several contributing factors affect thermal performance  
most notably the physical properties of the mechanical enclosure, location of the device on the PCB  
in relation to surrounding components and the number of PCB layers. Connecting the GND balls  
through thermal vias and into a large ground plane will aid heat extraction.  
Three main heat transfer paths exist to surrounding air as illustrated below in Figure 1:  
-
-
-
Package top to air (radiation).  
Package bottom to PCB (radiation).  
Package balls to PCB (conduction).  
Figure 1 Heat Transfer Paths  
The temperature rise TR is given by TR = PD * ӨJA  
-
-
PD is the power dissipated in the device.  
ӨJA is the thermal resistance from the junction of the die to the ambient temperature  
and is therefore a measure of heat transfer from the die to surrounding air. ӨJA is  
determined with reference to JEDEC standard JESD51-9.  
The junction temperature TJ is given by TJ = TA +TR, where TA is the ambient temperature.  
PARAMETER  
SYMBOL  
MIN  
-40  
-40  
TYP  
MAX  
85  
UNIT  
°C  
Operating temperature range  
Operating junction temperature  
Thermal Resistance  
(Junction to Case)  
TA  
TJ  
125  
°C  
ӨJC  
30  
60  
°C/W  
Thermal Resistance  
(Junction to Ambient)  
ӨJA  
°C/W  
Notes:  
1. Junction temperature is a function of ambient temperature and of the device operating conditions. The ambient  
temperature limits and junction temperature limits must both be observed.  
PD, May 2011, Rev 4.1  
9
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