WM8941
Pre Production
PACKAGE DIAGRAM
FL: 28 PIN QFN PLASTIC PACKAGE 4 X 4 X 0.75 mm BODY, 0.45 mm LEAD PITCH
DM042.B
DETAIL 1
D
D2
28
22
21
1
EXPOSED
GROUND
PADDLE
4
INDEX AREA
(D/2 X E/2)
6
E2
A
E
SEE DETAIL 2
15
0.226 Ref.
7
aaa
C
2 X
8
14
1
aaa
C
2 X
b
M
C
A
B
e
bbb
TOP VIEW
BOTTOM VIEW
SIDE VIEW
G
ccc
C
DETAIL 1
DETAIL 2
A3
A
L
5
0.08
C
Datum
Terminal
tip
e/2
45
degrees
A1
C
0.30mm
EXPOSED
DETAIL 2
SEATING PLANE
e
GROUND
PADDLE
R
A3
b
Exposed lead
DETAIL 2
Dimensions (mm)
Symbols
MIN
0.70
0
NOM
0.75
0.02
MAX
0.80
0.05
NOTE
A
A1
A3
b
0.203 REF
1
0.175
3.95
2.55
3.95
0.18
4.00
0.185
4.05
2.65
4.05
D
D2
E
2.6
4.00
2
2
E2
e
2.55
2.6
2.65
0.45 BSC
0.560
0.425
G
L
0.375
0.475
Tolerances of Form and Position
aaa
0.15
0.10
bbb
ccc
0.10
REF:
JEDEC, MO-220
NOTES:
1. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.15 mm AND 0.30 mm FROM TERMINAL TIP.
2. FALLS WITHIN JEDEC, MO-220.
3. ALL DIMENSIONS ARE IN MILLIMETRES.
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JEDEC 95-1 SPP-002.
5. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
6. REFER TO APPLICATIONS NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.
7. DEPENDING ON THE METHOD OF LEAD TERMINATION AT THE EDGE OF THE PACKAGE, PULL BACK (L1) MAY BE PRESENT.
8. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
PP, Rev 3.3, December 2007
94
w
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
