WM8940
Pre-Production
PACKAGE DIAGRAM
FL: 24 PIN QFN PLASTIC PACKAGE 4 X 4 X 0.9 mm BODY, 0.50 mm LEAD PITCH
DM035.C
DETAIL 1
D
D2
19
24
1
18
EXPOSED
GROUND
PADDLE
4
INDEX AREA
(D/2 X E/2)
6
E2
A
E
SEE DETAIL 2
13
6
aaa
C
2 X
12
7
1
b
aaa
C
2 X
M
bbb
C B
A
e
TOP VIEW
BOTTOM VIEW
SIDE VIEW
ccc
C
DETAIL 1
DETAIL 2
A3
A
L
5
0.08
C
L1
Datum
Terminal
tip
e/2
45
degrees
A1
C
0.32mm
EXPOSED
DETAIL 2
SEATING PLANE
e
GROUND
PADDLE
R
W
T
A3
G
H
b
Exposed lead
Half etch tie bar
DETAIL 2
Dimensions (mm)
Symbols
NOM
0.90
0.02
MIN
0.80
0
MAX
1.00
0.05
NOTE
A
A1
A3
b
0.20 REF
0.25
1
0.18
2.00
0.30
2.25
D
4.00
2.15
2
2
D2
E
E2
4.00
2.15
2.00
2.25
e
0.50 BSC
0.213
0.1
G
H
L
L1
T
0.30
0.03
0.40
0.50
0.15
7
0.1
0.2
W
Tolerances of Form and Position
aaa
bbb
ccc
0.15
0.10
0.10
REF:
JEDEC, MO-220, VARIATION VGGD-2.
NOTES:
1. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.15 mm AND 0.30 mm FROM TERMINAL TIP.
2. FALLS WITHIN JEDEC, MO-220, VARIATION VGGD-2.
3. ALL DIMENSIONS ARE IN MILLIMETRES.
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JEDEC 95-1 SPP-002.
5. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
6. REFER TO APPLICATIONS NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.
7. DEPENDING ON THE METHOD OF LEAD TERMINATION AT THE EDGE OF THE PACKAGE, PULL BACK (L1) MAY BE PRESENT.
8. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
Pre-Production, Rev 3.0, February 2007
84
w
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
