Pre-Production
WM8904
PACKAGE DIMENSIONS
The 36-ball W-CSP package drawing is shown below.
B: 36 BALL W-CSP PACKAGE 2.651 X 2.525 X 0.698mm BODY, 0.40 mm BALL PITCH
DM066.C
4
A
D
A
2
DETAIL 1
6
5
4
3
2
1
g
A2
A1
CORNER
A
B
5
e
C
D
E
F
E1
E
4
aaa
B
2 X
2 X
B
M
ddd Z A B
e
TOP VIEW
DETAIL 2
aaa A
D1
BOTTOM VIEW
f1
DETAIL 1
f2
bbb
Z
h
1
Z
ccc
A1
Z
DETAIL 2
Dimensions (mm)
Symbols
A
NOM
0.698
0.208
0.468
2.651
MIN
MAX
0.733
0.239
0.484
2.676
NOTE
0.663
0.177
A1
A2
0.452
2.626
D
D1
2.000 BSC
2.525
E
E1
e
2.500
2.550
2.000 BSC
0.400 BSC
5
f1
f2
0.313
0.250
g
0.022
0.258
0.025
0.060
h
0.218
0.298
aaa
bbb
ccc
0.030
0.015
ddd
NOTES:
1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’ AND BACKSIDE COATING.
3. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.
4. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.
5. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.
6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
7. FOLLOWS JEDEC DESIGN GUIDE MO-211-C.
PP, Rev 3.3, September 2012
185
w
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
