Advanced Information
WM8753L
PACKAGE DIAGRAM - 52-PIN BGA
B: 52 BALL BGA PLASTIC PACKAGE 5 X 5 X 0.9 mm BODY, 0.50 mm BALL PITCH
DM034.A
5
D
DETAIL 1
2
A
A2
9
8
7
6
5
4
3
2
1
A1
CORNER
A
B
4
C
D
E
F
e
E1
E
6
G
H
J
0.10
Z
2 X
e
TOP VIEW
2 X
0.10 Z
DETAIL 2
D1
BOTTOM VIEW
SOLDER BALL
bbb
Z
aaa
Z
b
1
Z
A1
3
ccc
ddd
DETAIL 1
Z
Z
X Y
DETAIL 2
Dimensions (mm)
Symbols
MIN
NOM
MAX
NOTE
A
0.95
1.11
1.27
A1
A2
b
0.15
0.80
0.25
0.27
1.00
0.21
0.90
0.30
0.35
D
D1
E
E1
e
5.00 BSC
4.00 BSC
5.00 BSC
4.00 BSC
0.50 BSC
6
Tolerances of Form and Position
aaa
bbb
ccc
ddd
0.80
0.10
0.15
0.05
NOTES:
1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’.
3. DIMENSION ‘b’ IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM -Z-.
4. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.
5. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.
6. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.
7. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
AI Rev 3.1 June 2004
86
w
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
