WM8750JL
Production Data
APPLICATIONS INFORMATION
RECOMMENDED EXTERNAL COMPONENTS
DVDD
AVDD
4
DGND
3
2
DBVDD
DCVDD
DGND
14
19
HPGND
AGND
18
17
AVDD
HPVDD
AGND
100nF
C3
C1 C2
100nF
C4
100nF
100nF
16
15
10
11
+
-
LOUT2
ROUT2
DGND
AGND
8 OHM
LOUDSPEAKER
1
MCLK
C13
1uF
+
5
9
7
6
8
BCLK
MONOOUT
OUT3
AUDIO
INTERFACE
(I2S/LJ/RJ/DSP)
ADCLRC
DACLRC
DACDAT
ADCDAT
32 OHM EAR
SPEAKER
220uF
13
12
+
C14
LOUT1
ROUT1
HIGH for 3-wire
LOW for 2-wire
29
MODE
C15
+
220uF
16 OR 32 OHM
HEADPHONES
30
31
32
CONTROL
INTERFACE
(2 OR 3-WIRE)
CSB
SDIN
SCLK
WM8750JL
C7
C8
28
27
26
25
24
22
20
1uF
1uF
LINPUT1
RINPUT1
LINPUT2
RINPUT2
LINPUT3
MICBIAS
VREF
DVDD
C6
AVDD
C20 C21
C18
C19
+
+
C9 1uF
21
C16
VMID
100nF
10uF 100nF 10uF
C5
+
C17
+
+
1uF
1uF
1uF
C10
C11
C12
10uF
100nF
10uF
10uF
AGND
AGND
AGND
AGND
33
DGND
23 RINPUT3 /
HPDETECT
GND_PADDLE
Layout Notes:
1. C1 to C4, C16, C18 and C20 should be as close to the relative WM8750JL connecting pin as possible.
2. AGND and DGND should be joined as close to the WM8750JL as possible.
3. C20 and C21 are only needed if MICBIAS is used externally.
4. For capacitors C5, C6, C17, C19 and C21 it is recommended that low ESR components are used.
5. For added strength and heat dissipation, it is recommended that the GND_PADDLE (Pin 33) is connected to AGND
Figure 50 Recommended External Components Diagram
PD, April 2012, Rev 4.1
56
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