Production Data
WM8741
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating
at or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical
Characteristics at the test conditions specified.
ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically
susceptible to damage from excessive static voltages. Proper ESD precautions must be taken during handling
and storage of this device.
Wolfson Microelectronics tests its package types according to IPC/JEDEC J-STD-020B for Moisture Sensitivity to determine
acceptable storage conditions prior to surface mount assembly. These levels are:
MSL1 = unlimited floor life at <30°C / 85% Relative Humidity. Not normally stored in moisture barrier bag.
MSL2 = out of bag storage for 1 year at <30°C / 60% Relative Humidity. Supplied in moisture barrier bag.
MSL3 = out of bag storage for 168 hours at <30°C / 60% Relative Humidity. Supplied in moisture barrier bag.
The Moisture Sensitivity Level for each package type is specified in Ordering Information.
CONDITION
MIN
-0.3V
MAX
+4.5V
Digital supply voltage, DVDD
Analogue supply voltage, AVDD
Voltage range digital inputs
-0.3V
+7V
DGND - 0.3V
AGND - 0.3V
DVDD + 0.3V
AVDD + 0.3V
38.462MHz
+85°C
Voltage range analogue inputs
Master Clock Frequency
Operating temperature range, TA
Storage temperature
-40°C
-65°C
-55°C
+150°C
Ambient temperature (supplies applied)
Pb free package body temperature (soldering 10 seconds)
Pb free package body temperature (soldering 2 minutes)
+125°C
+260°C
+183°C
Notes:
1. Analogue and digital grounds must always be within 0.3V of each other.
THERMAL PERFORMANCE
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Thermal resistance –
junction to case
θJC
23.9
°C/W
Thermal resistance –
junction to ambient
θJA
67.1
°C/W
PD, Rev 4.2, October 2009
9
w
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
