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WM8731SEFL 参数 Datasheet PDF下载

WM8731SEFL图片预览
型号: WM8731SEFL
PDF下载: 下载PDF文件 查看货源
内容描述: 便携式因特网音频编解码器与耳机驱动器和可编程的采样率 [Portable Internet Audio CODEC with Headphone Driver and Programmable Sample Rates]
分类和应用: 解码器驱动器编解码器电信集成电路便携式PC
文件页数/大小: 64 页 / 814 K
品牌: WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
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WM8731 / WM8731L  
Production Data  
PACKAGE DIMENSIONS - QFN  
FL: 28 PIN QFN PLASTIC PACKAGE 5 X 5 X 0.9 mm BODY, 0.50 mm LEAD PITCH  
DM023.G  
SEE DETAIL A  
CORNER  
TIE BAR  
D2  
B
D2/2  
27 28  
D
5
22  
INDEX AREA  
(D/2 X E/2)  
L
21  
1
2
EXPOSED  
GROUND  
PADDLE  
6
E2/2  
A
A
E2  
E
15  
7
SEE DETAIL B  
aaa  
C
14 13  
e
8
2 X  
2 X  
b
M
ccc  
C
A
B
B
aaa  
C
TOP VIEW  
BOTTOM VIEW  
DETAIL A  
CORNER  
TIE BAR  
ccc  
C
1
(A3)  
A
28x b  
5
1
M
0.08  
C
bbb  
C A B  
A1  
SEATING PLANE  
C
SIDE VIEW  
DETAIL B  
0.210mm  
EXPOSED  
GROUND  
PADDLE  
L1  
1
Dimensions (mm)  
Symbols  
MIN  
NOM  
0.90  
MAX  
1.00  
0.05  
NOTE  
A
A1  
A3  
b
0.85  
0
0.02  
0.2 REF  
0.23  
0.18  
3.2  
0.30  
3.4  
1
2
2
D
5.00 BSC  
3.3  
D2  
E
5.00 BSC  
3.3  
E2  
e
3.2  
3.4  
0.5 BSC  
0.4  
L
0.35  
0.45  
0.1  
L1  
R
1
b(min)/2  
0.20  
K
Tolerances of Form and Position  
aaa  
bbb  
ccc  
0.15  
0.10  
0.10  
REF:  
JEDEC, MO-220, VARIATION VHHD-1  
NOTES:  
1. DIMENSION b APPLIED TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP. DIMENSION L1 REPRESENTS TERMINAL PULL BACK FROM  
PACKAGE SIDE WALL. MAXIMUM OF 0.1mm IS ACCEPTABLE. WHERE TERMINAL PULL BACK EXISTS, ONLY UPPER HALF OF LEAD IS VISIBLE ON PACKAGE SIDE WALL DUE TO HALF  
ETCHING OF LEADFRAME.  
2. FALLS WITHIN JEDEC, MO-220 WITH THE EXCEPTION OF D2, E2:  
D2,E2: LARGER PAD SIZE CHOSEN WHICH IS JUST OUTSIDE JEDEC SPECIFICATION  
3. ALL DIMENSIONS ARE IN MILLIMETRES  
4. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.  
5. SHAPE AND SIZE OF CORNER TIE BAR MAY VARY WITH PACKAGE TERMINAL COUNT. CORNER TIE BAR IS CONNECTED TO EXPOSED PAD INTERNALLY  
6. REFER TO APPLICATION NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.  
PD, Rev 4.8, April 2009  
63  
w
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