WM8731 / WM8731L
Production Data
PACKAGE DIMENSIONS - QFN
FL: 28 PIN QFN PLASTIC PACKAGE 5 X 5 X 0.85 mm BODY, 0.50 mm LEAD PITCH
DM109.A
D2
0.10
C
A
B
B
D2/2
27 28
D
22
INDEX AREA
(D/2 X E/2)
L
21
1
2
EXPOSED
GROUND
PADDLE
6
E2/2
A
A
E2
E
15
7
SEE DETAIL A
aaa
C
14 13
e
8
2 X
2 X
b
M
A
ccc
C
B
B
aaa
C
TOP VIEW
BOTTOM VIEW
0.10
C
(A3)
1
DETAIL A
A
0.08
C
A1
SEATING PLANE
C
SIDE VIEW
Dimensions (mm)
Symbols
MIN
0.80
0
NOM
0.85
MAX
0.90
0.05
NOTE
A
A1
A3
b
0.035
0.203 REF
0.25
0.20
3.00
3.00
0.30
3.20
3.20
0.60
1
2
2
2
D
5.00 BSC
3.10
D2
E
5.00 BSC
3.10
E2
e
0.5 BSC
0.55
L
0.50
R
b(min)/2
Tolerances of Form and Position
aaa
0.10
0.10
bbb
ccc
0.10
JEDEC, MO-220, VARIATION VHHD-3
REF:
NOTES:
1. DIMENSION b APPLIED TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP.
2. FALLS WITHIN JEDEC, MO-220 WITH THE EXCEPTION OF D2, E2 AND L:
D2,E2: SMALLER PAD SIZE CHOSEN WHICH IS JUST OUTSIDE JEDEC SPECIFICATION, L IS SLIGHTLY LARGER THAN JEDEC SPEC.
3. ALL DIMENSIONS ARE IN MILLIMETRES.
4. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
5. SHAPE AND SIZE OF CORNER TIE BAR MAY VARY WITH PACKAGE TERMINAL COUNT. CORNER TIE BAR IS CONNECTED TO EXPOSED PAD INTERNALLY.
6. REFER TO APPLICATION NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.
PD, Rev 4.9, October 2012
63
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WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
