WM8594
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ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at
or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical
Characteristics at the test conditions specified.
ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible
to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage
of this device.
Wolfson tests its package types according to IPC/JEDEC J-STD-020B for Moisture Sensitivity to determine acceptable storage
conditions prior to surface mount assembly. These levels are:
MSL1 = unlimited floor life at <30°C / 85% Relative Humidity. Not normally stored in moisture barrier bag.
MSL2 = out of bag storage for 1 year at <30°C / 60% Relative Humidity. Supplied in moisture barrier bag.
MSL3 = out of bag storage for 168 hours at <30°C / 60% Relative Humidity. Supplied in moisture barrier bag.
The Moisture Sensitivity Level for each package type is specified in Ordering Information.
CONDITION
MIN
-0.3V
MAX
+4.5V
Digital supply voltage, DVDD
Analogue supply voltage, AVDD1
Analogue supply voltage, AVDD2
Voltage range digital inputs
-0.3V
+7V
-0.3V
+15V
DGND -0.3V
TBD
DVDD + 0.3V
AVDD1 + 0.2V
38.462MHz
+125°C
Voltage range analogue inputs
Master Clock Frequency
Ambient temperature (supplies applied)
Storage temperature
-55°C
-65°C
+150°C
Pb free package body temperature (reflow 10 seconds)
Package body temperature (soldering 2 minutes)
+260°C
+183°C
Note:
1. Analogue and digital grounds must always be within 0.3V of each other.
THERMAL PERFORMANCE
PARAMETER
SYMBOL
TEST
CONDITIONS
MIN
TYP
MAX
UNIT
°C/W
Thermal resistance – junction to
ambient
51.7
RθJA
See note 1
Notes:
1. Figure given for package mounted on 4-layer FR4 according to JESD51-7. (No forced air flow is assumed).
2. Thermal performance figures are estimated.
PP Rev 1.0 January 2007
6
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