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WM8594SEFT/RV 参数 Datasheet PDF下载

WM8594SEFT/RV图片预览
型号: WM8594SEFT/RV
PDF下载: 下载PDF文件 查看货源
内容描述: 24位192kHz的2Vrms的多通道编解码器 [24-bit 192kHz 2Vrms Multi-Channel CODEC]
分类和应用: 解码器编解码器
文件页数/大小: 78 页 / 759 K
品牌: WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
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WM8594  
Product Preview  
ABSOLUTE MAXIMUM RATINGS  
Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at  
or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical  
Characteristics at the test conditions specified.  
ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible  
to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage  
of this device.  
Wolfson tests its package types according to IPC/JEDEC J-STD-020B for Moisture Sensitivity to determine acceptable storage  
conditions prior to surface mount assembly. These levels are:  
MSL1 = unlimited floor life at <30°C / 85% Relative Humidity. Not normally stored in moisture barrier bag.  
MSL2 = out of bag storage for 1 year at <30°C / 60% Relative Humidity. Supplied in moisture barrier bag.  
MSL3 = out of bag storage for 168 hours at <30°C / 60% Relative Humidity. Supplied in moisture barrier bag.  
The Moisture Sensitivity Level for each package type is specified in Ordering Information.  
CONDITION  
MIN  
-0.3V  
MAX  
+4.5V  
Digital supply voltage, DVDD  
Analogue supply voltage, AVDD1  
Analogue supply voltage, AVDD2  
Voltage range digital inputs  
-0.3V  
+7V  
-0.3V  
+15V  
DGND -0.3V  
TBD  
DVDD + 0.3V  
AVDD1 + 0.2V  
38.462MHz  
+125°C  
Voltage range analogue inputs  
Master Clock Frequency  
Ambient temperature (supplies applied)  
Storage temperature  
-55°C  
-65°C  
+150°C  
Pb free package body temperature (reflow 10 seconds)  
Package body temperature (soldering 2 minutes)  
+260°C  
+183°C  
Note:  
1. Analogue and digital grounds must always be within 0.3V of each other.  
THERMAL PERFORMANCE  
PARAMETER  
SYMBOL  
TEST  
CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
°C/W  
Thermal resistance – junction to  
ambient  
51.7  
RθJA  
See note 1  
Notes:  
1. Figure given for package mounted on 4-layer FR4 according to JESD51-7. (No forced air flow is assumed).  
2. Thermal performance figures are estimated.  
PP Rev 1.0 January 2007  
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