Pre-Production
WM8501
PACKAGE DRAWING
DM001.C
D: 14 PIN SOIC 3.9mm Wide Body
e
B
14
8
H
E
1
7
D
L
h x 45o
A1
SEATING PLANE
-C-
α
A
C
0.10 (0.004)
Dimensions
(MM)
Dimensions
(Inches)
Symbols
MIN
MAX
1.75
0.25
0.51
0.25
8.75
4.00
MIN
MAX
A
A1
B
C
D
E
1.35
0.10
0.33
0.19
8.55
3.80
0.0532
0.0040
0.0130
0.0075
0.3367
0.1497
0.0688
0.0098
0.0200
0.0098
0.3444
0.1574
e
1.27 BSC
0.05 BSC
H
h
L
5.80
0.25
0.40
0o
6.20
0.50
1.27
8o
0.2284
0.0099
0.0160
0o
0.2440
0.0196
0.0500
8o
α
REF:
JEDEC.95, MS-012
NOTES:
A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS (INCHES).
B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM (0. 010IN).
D. MEETS JEDEC.95 MS-012, VARIATION = AB. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.
PP Rev 3.1 May 2006
19
w
WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
