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WAN-0129 参数 Datasheet PDF下载

WAN-0129图片预览
型号: WAN-0129
PDF下载: 下载PDF文件 查看货源
内容描述: 去耦和布局方法论欧胜的DAC , ADC和编解码器 [Decoupling and Layout Methodology for Wolfson DACs, ADCs and CODECs]
分类和应用: 解码器编解码器
文件页数/大小: 3 页 / 52 K
品牌: WOLFSON [ WOLFSON MICROELECTRONICS PLC ]
 浏览型号WAN-0129的Datasheet PDF文件第1页浏览型号WAN-0129的Datasheet PDF文件第3页  
WAN_0129  
ANALOGUE SUPPLY  
Analogue supply pins must be connected to a low-noise analogue supply rail, which ideally comes  
from a low-noise linear regulator. We name these pins like this: AVDD, HPVDD, SPKVDD. Be sure  
to place a 0.1µF multi-layer ceramic capacitor close to each of these pins (within 3mm) to decouple it  
properly to AGND. If there is no large-value capacitor within 50mm, then also add one 10µF low-  
ESR capacitor per rail. This can be multi-layer ceramic, low-ESR tantalum or low-ESR organic  
semiconductor electrolytic type. Check the datasheet shows the part has less than 200mESR for  
best performance.  
On some of our devices there are internal supplies or references which require external decoupling.  
We names these pins like: VMID, VREF, VREFOUT, CAP2. The pins connect just to a capacitor,  
not to an external supply. Be sure to place a 0.1µF multi-layer ceramic capacitor close to each of  
these pins (within 3mm) to decouple it properly to AGND. Also add one 10µF low-ESR capacitor per  
pin. This can be multi-layer ceramic, low-ESR tantalum or low-ESR organic semiconductor  
electrolytic type. Check the datasheet shows the part has less than 200mESR for best  
performance.  
SUPPLY LAYOUT  
SOLUTION  
Ideally the supply connections will be made with planes on a multi-layer circuit board. If these planes  
are on adjacent layers, the parasitic capacitance of these layers will further improve high-frequency  
decoupling. Where this is not possible, use tracks much wider than the current rating requires.  
DVDD  
+
AVDD  
+
7
6
10  
14  
DVDD  
DGND  
AVDD  
C1  
C2  
VREFP  
C3  
C4  
C5  
9
AGND  
DGND  
13  
VREFN  
AGND  
12  
VMI  
+
C8  
C9  
AGND  
Notes:  
1. AGND and DGND should be connected as close to the IC as possible.  
2. C, C3, C4 and C should be 0.1µF multi-layer ceramics, positioned as close to the IC as possible.  
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8
3. Capacitor types for C , C , C should be carefully chosen. 10µF capacitors with low ESR are  
1
5
9
recommended for optimum performance.  
Figure 2 Decoupling Example  
CONCLUSION  
With careful consideration of layout and provision of low-noise supplies, the performance specified in  
our datasheets should be achieved.  
APPLICATION SUPPORT  
If you require more information or require technical support please contact Wolfson Microelectronics  
Applications group through the following channels:  
Email:  
Telephone:  
Fax:  
apps@wolfsonmicro.com  
+44 (0)131 272 7070  
+44 (0)131 272 7001  
Mail:  
Applications at the address on last page.  
or contact your local Wolfson representative.  
Additional information may be made available from time to time on our web site at  
http://www.wolfsonmicro.com  
January 2003, Rev 1.0  
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