The Communications Edge TM
SCG015
¼ Watt, High Linearity InGaP HBT Amplifier
Product Information
SCG015B-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded
(maximum 245°C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The component will be marked with an
“S015G” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1B
Land Pattern
Value:
Test:
Passes at between 500 and 1000V
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 °C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board
to
a heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
MTTF vs. GND Tab Temperature
Thermal Specifications
100000
10000
1000
Parameter
Rating
-40 to +85 °C
128 °C / W
149 °C
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tjc (2)
Notes:
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85° C.
2. This corresponds to the typical biasing condition of
100
+5V, 100 mA at an 85° C case temperature.
A
60
70
80
90
100
110
120
minimum MTTF of 1 million hours is achieved for
Tab Temperature (°C)
junction temperatures below 247° C.
Tjc = Tcase + Rth * Vde * Icc
Specifications and information are subject to change without notice
Page 5 of 5 October 2006
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
WJCI [ WJ COMMUNICATION. INC. ]
