The Communications Edge
TM ECP203
2 Watt, High Linearity InGaP HBT Amplifier
Product Information
ECP203D (16-pin 4x4mm Package) Mechanical Information
Outline Drawing Product Marking
The component will be marked with an
“ ECP203D” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “ Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1B
Value:
Test:
Standard:
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Land Pattern
MSL Rating: Level 3 at +235 C convection reflow
Standard: JEDEC Standard J-STD-020
0.25mm DIA. THERMAL GROUND VIA HOLE VIAS ARE PLACED
ON A 0.65mm GRID. VIAS ARE TO BE CONNECTED TO TOP,
BOTTOM, AND INTERNAL GROUND PLANES IN ORDER TO
MAXIMIZE HEAT DISSIPATION. FOR .031" THK FR4 MATERIA
VIA BARREL PLATING TO BE MIN. 0.0014 THICK. VIAS TO BE
PLUGGED WITH EITHER CONDUCTIVE OR NON-CONDUCTIV
EPOXY TO PREVENT SOLDER. DRAINS THROUGH VIA IN
REFLOW PROCESS
Functional Diagram
0.65mm
TYP.
GROUND PLANE AREA FOR VIAS
2.23mm X 2.23mm
16 15
14
13
N/C
12
11
10
9
1
2
3
4
Vref
N/C
DEVICE GROUND PAD
2.0mm X 2.0mm
RFOUT
RFOUT
N/C
RECOMMENDED PAD
0.76mm X 0.34mm
RFIN
N/C
SOLDERMASK SWELL TO BE 0.5mm
FROM OUTSIDE EDGE OF ALL PADS
5
6
7
8
TYP.
4.00mm
Function
Vref
RF Input
RF Output
Vbias
Pin No.
16L 4.0mm X 4.0mm PACKAGE
1
3
10, 11
16
GND
N/C or GND
Backside Paddle
2, 4-9, 12-15
Thermal Specifications
MTTFvs. GNDTabTemperature
100000
10000
1000
Parameter
Rating
Operating Case Temperature
-40 to +85q C
17.5q C / W
155q C
Thermal Resistance, Rth (1)
Mounting Config. Notes
Junction Temperature, Tjc (2)
Notes:
1. A heatsink underneath the area of the PCB for the mounted
device is strictly required for proper thermal operation.
Damage to the device can occur without the use of one.
2. Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25
mm (.010”).
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85 C. Tjc is a function
of the voltage at pins 10 and 11 and the current applied
to pins 10, 11, and 16 and can be calculated by:
Tjc = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of +5V,
800 mA at an 85 C case temperature. A minimum
MTTF of 1 million hours is achieved for junction
temperatures below 247 C.
100
60
70
80
90
100 110 120
3. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
4. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
TabTemperature(°C)
5. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
7. Use 1 oz. Copper minimum.
8
All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
Web site: www.wj.com OCtober 2004
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com
WJCI [ WJ COMMUNICATION. INC. ]
