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EC1089B-G 参数 Datasheet PDF下载

EC1089B-G图片预览
型号: EC1089B-G
PDF下载: 下载PDF文件 查看货源
内容描述: 的InGaP HBT增益模块 [InGaP HBT Gain Block]
分类和应用: 射频微波
文件页数/大小: 5 页 / 283 K
品牌: WJCI [ WJ COMMUNICATION. INC. ]
 浏览型号EC1089B-G的Datasheet PDF文件第1页浏览型号EC1089B-G的Datasheet PDF文件第2页浏览型号EC1089B-G的Datasheet PDF文件第3页浏览型号EC1089B-G的Datasheet PDF文件第4页  
The Communications Edge TM  
EC1089  
¼ Watt, High Linearity InGaP HBT Amplifier  
Product Information  
EC1089B-G (Green / Lead-free SOT-89 Package) Mechanical Information  
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 qC reflow temperature) and leaded  
(maximum 245 qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.  
Outline Drawing  
Product Marking  
The component will be marked with an  
“1089G” designator with an alphanumeric lot  
code on the top surface of the package. The  
obsolete tin-lead package is marked with a  
“1089” designator followed by an  
alphanumeric lot code.  
Tape and reel specifications for this part are  
located on the website in the “Application  
Notes” section.  
MSL / ESD Rating  
ESD Rating: Class 1A  
Value:  
Test:  
Standard:  
Passes between 250 and 500V  
Human Body Model (HBM)  
JEDEC Standard JESD22-A114  
Land Pattern  
MSL Rating: Level 3 at +260 C convection reflow  
Standard: JEDEC Standard J-STD-020  
Mounting Config. Notes  
1. Ground  
/ thermal vias are critical for the proper  
performance of this device. Vias should use a .35mm  
(#80 / .0135” ) diameter drill and have a final plated  
thru diameter of .25 mm (.010”).  
2. Add as much copper as possible to inner and outer  
layers near the part to ensure optimal thermal  
performance.  
3. Mounting screws can be added near the part to fasten  
the board to a heatsink. Ensure that the ground /  
thermal via region contacts the heatsink.  
4. Do not put solder mask on the backside of the PC board  
in the region where the board contacts the heatsink.  
5. RF trace width depends upon the PC board material  
and construction.  
6. Use 1 oz. Copper minimum.  
7. All dimensions are in millimeters (inches). Angles are  
in degrees.  
Thermal Specifications  
MTTF vs. GND Tab Temperature  
1000.0  
100.0  
10.0  
Parameter  
Rating  
-40 to +85 qC  
149 qC / W  
204 qC  
Operating Case Temperature  
Thermal Resistance (1)  
Junction Temperature (2)  
Notes:  
1. The thermal resistance is referenced from the junction-  
to-case at a case temperature of 85 C.  
2. This corresponds to the typical biasing condition of +5V,  
160 mA at an 85 C case temperature. A minimum  
MTTF of 1 million hours is achieved for junction  
temperatures below 247 C.  
1.0  
60  
70  
80  
90  
100  
110  
120  
Tab Temperature (°C)  
Specifications and information are subject to change without notice  
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com  
Web site: www.wj.com  
Page 5 of 5  
April 2006