AP603
High Dynamic Range 7W 28V HBT Amplifier
AP603-F Mechanical Information
This package is lead-free and RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
(maximum 245 °C reflow temperature) soldering processes. The plating material on the pins is annealed matte tin over copper.
Drawing
Outline Drawing
Product Marking
The component will be laser marked with an
“AP603-F” product label with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part will be
located on the website in the “Application
Notes” section.
Functional Pin Layout
Mounting Configuration / Land Pattern
Pin
1
Function
PIN_VBIAS
N/C
2, 3, 7, 8, 12, 13
4, 5, 6
RF IN
9, 10, 11
14
Backside paddle
RF Output / Vcc
PIN_VPD
GND
MSL / ESD Rating
ESD Rating: Class 1B
Value:
Test:
Standard:
Passes ꢀ500V to <1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Test:
Standard:
Passes ꢀ1000V to <2000V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
MTTF vs. Junction Temperature
1.E+09
Thermal Specifications
Parameter
Rating
1.E+08
1.E+07
1.E+06
1.E+05
MSL Rating: Level 3 at +260 °C convection reflow
Standard: JEDEC Standard J-STD-020
Thermal Resistance, ΘJC
8.7 °C / W
Referenced from peak junction to the
center of the bottomside ground paddle
Junction Temperature, TJ
192 ºC
250 ºC
For 106 hours MTTF
Max Junction Temperature, TJ,max
For catastrophic failure
120
140
160
180
200
Junction Temperature (°C)
Specifications and information are subject to change without notice
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WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com