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AG503-86G 参数 Datasheet PDF下载

AG503-86G图片预览
型号: AG503-86G
PDF下载: 下载PDF文件 查看货源
内容描述: 的InGaP HBT增益模块 [InGaP HBT Gain Block]
分类和应用: 射频微波
文件页数/大小: 6 页 / 369 K
品牌: WJCI [ WJ COMMUNICATION. INC. ]
 浏览型号AG503-86G的Datasheet PDF文件第1页浏览型号AG503-86G的Datasheet PDF文件第2页浏览型号AG503-86G的Datasheet PDF文件第3页浏览型号AG503-86G的Datasheet PDF文件第4页浏览型号AG503-86G的Datasheet PDF文件第6页  
The Communications Edge TM  
AG503-86  
InGaP HBT Gain Block  
Product Information  
AG503-86 (SOT-86 Package) Mechanical Information  
This package may contain lead-bearing materials. The plating material on the leads is SnPb.  
Outline Drawing  
Product Marking  
The componenwill be marked with an “H”  
designator fllowed by a two-dgit numeric  
lot code on the op surface of he package.  
Tape aeel specifications for this part are  
located on the website in the “Application  
Notes” section.  
MSL / ESD Rating  
ESD Rating: Class 0  
Value:  
Test:  
Standard:  
Passes at 150 V  
Human Body Model (HBM)  
JEDEC Standard JESD22-A114  
ESD Rating: Class II  
Value:  
Test:  
Standard:  
Passes at 250 V  
Charged Device Model (CDM)  
JEDEC Standard JESD22-C101  
Land Pattern  
MSL Rating: Level 1  
Standard:  
JEDEC Standard J-STD-020A  
Mounting Config. Notes  
1. Ground / thermal vias are critical for the proper performance  
of this device. Vias should use a .35mm (#80 / .0135”)  
diameter drill and have a final plated thru diameter of .25 mm  
(.010”).  
2. Add as much copper as possible to inner and outer layers near  
the part to ensure optimal thermal performance.  
3. Mounting screws can be added near the part to fasten the  
board to a heatsink. Ensure that the ground / thermal via  
region contacts the heatsink.  
4. Do not put solder mask on the backside of the PC board in the  
region where the board contacts the heatsink.  
5. RF trace width depends upon the PC board material and  
construction.  
6. Use 1 oz. Copper minimum.  
7. All dimensions are in millimeters (inches). Angles are in  
degrees.  
Thermal Speciications  
MTTF vs. GND Lead Temperature  
1000  
100  
10  
Parameter  
Rating  
-40 to +85 °C  
257 °C/W  
143 °C  
Operating Case Tmperature  
Thermal Resisance, Rth (1)  
Junction Temperaure, Tjc (2)  
1. The thermal resistance is referenced from the hottest part  
of the unction to the ground lead (pin 2 or 4
2. This corresponds to he typical biasing condition of  
1
60  
70  
80  
90  
100  
110  
120  
+03V, 45 mA at an 85 °C case temperature.  
A
Ground Lead Temperature (°C)  
minimum MTTF of 1 million hours is achieved for  
unction temperatures below 177 °C.  
Specifications and information are subject to change without notice  
Page 5 of 6 July 2005  
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com