The Communications Edge TM
AG201-63
InGaP HBT Gain Block
Product Information
AG201-63G (Green / Lead-free SOT-363 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is annealed matte tin over copper.
Outline Drawing
Product Marking
The component will be marked with an “F”
designator followed by a two-digit numeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“A” designator followed by
numeric lot code.
a two-digit
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1C
Value:
Test:
Standard:
Passes ≥ 1000V min.
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Test:
Standard:
Passes ≥ 1000V min.
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
Land Pattern
MSL Rating: Level 3 at +260 °C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground
/ thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated thru
diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
MTTF vs. GNDLead Temperature
Thermal Specifications
10000
1000
100
10
Parameter
Rating
-40 to +85 °C
410 °C / W
118 °C
Operating Case Temperature
Thermal Resistance, Rth (1)
Junction Temperature, Tj (2)
1. The thermal resistance is referenced from the hottest
part of the junction to the ground pin (pin 4).
2. This corresponds to the typical biasing condition of
1
+4.0V, 20 mA at an 85 °C case temperature.
A
60
70
80
90
100 110 120
minimum MTTF of 1 million hours is achieved for
GroundLeadTemperature(°C)
junction temperatures below 177 °C.
Specifications and information are subject to change without notice
Page 5 of 5 April 2006
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com
WJCI [ WJ COMMUNICATION. INC. ]
