WS82C55A
(Unit : mm)
Mirror finish
Package material
Epoxy resin
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
42 alloy
Solder plating
5 mm or more
0.41 TYP.
QFP-44
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
25
Wing Shing [ WING SHING COMPUTER COMPONENTS ]
