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W25Q32BVSSIG 参数 Datasheet PDF下载

W25Q32BVSSIG图片预览
型号: W25Q32BVSSIG
PDF下载: 下载PDF文件 查看货源
内容描述: 具有双路和四路SPI 3V 32M位串行闪存 [3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI]
分类和应用: 闪存
文件页数/大小: 79 页 / 978 K
品牌: WINBOND [ WINBOND ]
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W25Q32BV  
1. GENERAL DESCRIPTION  
The W25Q32BV (32M-bit) Serial Flash memory provides a storage solution for systems with limited  
space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash  
devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP)  
and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current  
consumption as low as 4mA active and 1µA for power-down.  
The W25Q32BV array is organized into 16,384 programmable pages of 256-bytes each. Up to 256 bytes  
can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128  
(32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q32BV  
has 1,024 erasable sectors and 64 erasable blocks respectively. The small 4KB sectors allow for greater  
flexibility in applications that require data and parameter storage. (See figure 2.)  
The W25Q32BV supports the standard Serial Peripheral Interface (SPI), and a high performance  
Dual/Quad output as well as Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1  
(DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 104MHz are supported allowing  
equivalent clock rates of 208MHz (104MHz x 2) for Dual I/O and 320MHz (80MHz x 4) for Quad I/O when  
using the Fast Read Dual/Quad I/O instructions. These transfer rates can outperform standard  
Asynchronous 8 and 16-bit Parallel Flash memories. The Continuous Read Mode allows for efficient  
memory access with as few as 8-clocks of instruction-overhead to read a 24-bit address, allowing true XIP  
(execute in place) operation.  
A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control,  
provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and  
device identification with a 64-bit Unique Serial Number.  
2. FEATURES  
– 4mA active current, <1µA Power-down (typ.)  
– -40°C to +85°C operating range  
Family of SpiFlash Memories  
– W25Q32BV: 32M-bit / 4M-byte (4,194,304)  
– 256-byte per programmable page  
– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold  
– Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold  
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3  
Flexible Architecture with 4KB sectors  
– Uniform Sector/Block Erase (4/32/64K-bytes)  
– Program one to 256 bytes  
– Erase/Program Suspend & Resume  
Highest Performance Serial Flash  
– 104MHz Dual SPI / 80MHz Quad SPI clocks  
– 208/320MHz equivalent Dual/Quad SPI  
– 40MB/S continuous data transfer rate  
– Up to 8X that of ordinary Serial Flash  
– More than 100,000 erase/program cycles(1)  
– More than 20-year data retention  
Advanced Security Features  
– Software and Hardware Write-Protect  
– Top/Bottom, 4KB complement array protection  
– Power Supply Lock-Down and OTP protection  
– 64-Bit Unique ID for each device  
– Discoverable Parameters (SFDP) Register  
– 3X256-Byte Security Registers with OTP locks  
– Volatile & Non-volatile Status Register Bits  
Efficient “Continuous Read Mode”  
– Low Instruction overhead  
– Continuous Read with 8/16/32/64-Byte Wrap  
– As few as 8 clocks to address memory  
– Allows true XIP (execute in place) operation  
– Outperforms X16 Parallel Flash  
Space Efficient Packaging  
– 8-pin SOIC 208-mil  
– 8-pad WSON 6x5-mm/8x6-mm(2)  
– 16-pin SOIC 300-mil  
– 8-pin PDIP 300-mil  
– 24-ball TFBGA 8x6-mm  
– Contact Winbond for KGD and other options  
Low Power, Wide Temperature Range  
– Single 2.7 to 3.6V supply  
Note 1. More than 100,000 Block Erase/Program cycles for Industrial and Automotive temperature; more than  
10,000 full chip Erase/Program cycles tested in compliance with AEC-Q100.  
2. WSON 8x6-mm is a special order package, please contact Winbond for ordering information.  
Publication Release Date: April 01, 2011  
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