ISD4002 SERIES
12.5. DIE INFORMATION
ISD4002 Series
VCCD
MOSI
MISO
SCLK
SS
VSSD
VSSD
INT
RAC
o
Die Dimensions [1]
VCCD
XCLK
VSSA
X: 166.6 ± 1 mils
Y: 222.5 ± 1 mils
o
o
Die Thickness [2]
ISD4002
11.5 ± 0.5 mils
≈
≈
Pad Opening
Single pad opening: 90 x 90 µm
Double pad opening: 180 x 90 µm
[3]
[3]
VSSA
VCCA
AUD OUT
AM CAP
ANA IN-
ANA IN+
[3]
[3]
VSSA
VCCA
VSSA
Notes:
[1]
The backside of die is internally connected to VSS. It MUST NOT be connected to any other potential or
damage may occur.
[2]
[3]
Die thickness is subject to change, please contact Winbond as this thickness may change in the future.
Double bond is recommended if treated as one single pad.
- 34 -