ISD4002 SERIES
11. TYPICAL APPLICATION CIRCUIT
These application examples are for illustration purposes only. Winbond makes no representation or
warranty that such application will be suitable for production.
Make sure all bypass capacitors are as close as possible to the package.
C9
15-30 pF
C8
15-25 pF
VCC
U2
U1
39
38
29
30
31
32
33
34
3
2
27
4
OCS1
OCS2
PD0/RDI
MISO
MOSI
SCLK
SS
VCCD
R7
µ
C2 0.22
F
F
Ω
10 K
PD1/TD0
PD2/MISO
PD3/MOSI
PD4/SCK
PD5/SS
VSSD
28
1
C1
47
1
2
RESET
IRQ
F
µ
18
23
12
11
13
VCCA
µ
C3 0.22
VSSA
VSSA
37
35
28
27
26
25
24
23
22
21
TCAP
PC0
PC1
PC2
PC3
PC4
PC5
C4
C11
VSSA
µ
µ
1
F
0.1
F
J1
16
17
3
4
5
1
ANA IN-
AUD OUT
ISD4002
LINE OUT
C12
TCMP
µ
R2
1M
0.1
F
ANA IN+
R1
10K
68HC705C8PPC6
24
25
PC7
RAC
INT
14
AM CAP
R4
100K POT
R3 100
12
13
14
15
16
17
18
19
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
1
R6
3
C5
Ω
47 K
µ
1
F
2
U3
11
10
9
26
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
PD7
XCLK
13
11
-IN
GAIN-OUT
V01
J4
3
2
4
5
1
10
14
+IN
EXT
8
SPEAKER
15
12
V02
VDD
PDIP / SOIC
5
BYPASS
7
6
6
7
HP-IN1
HP-IN2
C6
C7
µ
1
F
1
4
8
9
GND
GND
GND
GND
GND
µ
.1
F
5
4
3
2
HPSENSE
R5
Ω
47 K
SHUTDOWN
16
LM4860M
FIGURE 9: APPLICATION EXAMPLE USING SPI
Publication Release Date: October 26, 2005
Revision 1.3
- 27 -
WINBOND [ WINBOND ]
