欢迎访问ic37.com |
会员登录 免费注册
发布采购

ISD17120PYI01 参数 Datasheet PDF下载

ISD17120PYI01图片预览
型号: ISD17120PYI01
PDF下载: 下载PDF文件 查看货源
内容描述: 多信息单芯片语音记录和回放设备 [Multi-Message Single-Chip Voice Record & Playback Devices]
分类和应用:
文件页数/大小: 24 页 / 351 K
品牌: WINBOND [ WINBOND ]
 浏览型号ISD17120PYI01的Datasheet PDF文件第1页浏览型号ISD17120PYI01的Datasheet PDF文件第3页浏览型号ISD17120PYI01的Datasheet PDF文件第4页浏览型号ISD17120PYI01的Datasheet PDF文件第5页浏览型号ISD17120PYI01的Datasheet PDF文件第6页浏览型号ISD17120PYI01的Datasheet PDF文件第7页浏览型号ISD17120PYI01的Datasheet PDF文件第8页浏览型号ISD17120PYI01的Datasheet PDF文件第9页  
ISD1700 SERIES  
TABLE OF CONTENTS  
1
2
3
4
5
6
GENERAL DESCRIPTION..............................................................................................................3  
FEATURES......................................................................................................................................4  
BLOCK DIAGRAM...........................................................................................................................5  
PINOUT CONFIGURATION............................................................................................................6  
PIN DESCRIPTION .........................................................................................................................7  
MODES OF OPERATIONS.............................................................................................................8  
6.1 Standalone (Push-Button) Mode .............................................................................................8  
6.2 SPI Mode .................................................................................................................................8  
7
TIMING DIAGRAMS........................................................................................................................8  
7.1 Standalone Operation..............................................................................................................8  
7.2 SPI Operation.........................................................................................................................12  
8
9
ABSOLUTE MAXIMUM RATINGS................................................................................................13  
8.1 Operating Conditions .............................................................................................................13  
ELECTRICAL CHARACTERISTICS .............................................................................................14  
9.1 DC Parameters ......................................................................................................................14  
9.2 AC Parameters.......................................................................................................................15  
10 TYPICAL APPLICATION CIRCUITS.............................................................................................16  
10.1 Good Audio Design Practices................................................................................................18  
11 PACKAGING .................................................................................................................................19  
11.1 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC....................19  
11.2 28-Lead 300-Mil Plastic Small Outline Integrated Circuit (SOIC)..........................................20  
11.3 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................21  
11.4 Die Information.......................................................................................................................21  
12 ORDERING INFORMATION.........................................................................................................22  
13 VERSION HISTORY......................................................................................................................23  
- 2 -  
 复制成功!