ISD4004 SERIES
12.5. DIE INFORMATION
ISD4004 Series
o
Die Dimensions (with scribe line) [1]
VCCD
MOSI
MISO
SCLK
SS
VSSD
VSSD
INT
RAC
VCCD
XCLK
X: 166.6 ± 1 mils
Y: 385.0 ± 1 mils
VSSA
o
o
Die Thickness [2]
11.5 ± 0.5 mils
Pad Opening
Single pad: 90 x 90 microns
Double pad: 180 x 90 microns
ISD4004
≈
≈
[3]
[3]
VSSA
VCCA
AUD OUT
AM CAP
ANA IN-
ANA IN+
[3]
[3]
VSSA
VCCA
VSSA
Notes:
[1]
The backside of die is internally connected to VSS. It MUST NOT be connected to any other potential or
damage may occur.
[2]
[3]
Die thickness is subject to change, please contact Winbond as this thickness may change in the future.
Double bond is recommended if treated as one pad.
- 34 -
WINBOND [ WINBOND ]
