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SESDXXXWB 参数 Datasheet PDF下载

SESDXXXWB图片预览
型号: SESDXXXWB
PDF下载: 下载PDF文件 查看货源
内容描述: 瞬态电压抑制器ESD保护 [Transient Voltage Suppressors for ESD Protection]
分类和应用:
文件页数/大小: 2 页 / 290 K
品牌: WILLAS [ WILLAS ELECTRONIC CORP ]
 浏览型号SESDXXXWB的Datasheet PDF文件第2页  
WILLAS
Transient Voltage Suppressors for ESD Protection
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS -20V- 200V
SOD-123
Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space.
DESCRIPTION
Low power loss, high efficiency.
High current
SERIES
is designed to protect
The
SESDxxxWB
capability, low forward voltage drop.
voltage sensitive
High surge capability.
components from ESD. Excellent clamping capability, low leakage,
Guardring for overvoltage protection.
and fast
Ultra high-speed
provide best in class protection on designs that
response time
switching.
Silicon
ESD. Because of its small size, it is suited for use in
are exposed to
epitaxial planar chip, metal silicon junction.
Lead-free parts meet environmental standards of
MIL-STD-19500 /228
cellular phones, MP3 players, digital cameras and many other portable
RoHS product for packing code suffix "G"
applications where board space is at a premium.
Halogen free product for packing code suffix "H"
FM120-M
SESDxxxWB
THRU
FM1200-M
Pb Free Product
PACKAGE
Features
Package outline
SOD-123H
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
WBFBP-02C
(1 .0×0.6×0.5)
unit: mm
0.071(1.8)
0.056(1.4)
Mechanical data
FEATURES
0.024(0.6)
Epoxy : UL94-V0 rated flame retardant
Stand−off
:
Voltage: 3.3 V−12 V
Case Molded plastic, SOD-123H
0.031(0.8) Typ.
0.031(0.8) Typ.
,
Leakage
Low
Terminals :Plated terminals, solderable per MIL-STD-750
Method 2026
Response Time is Typically < 1 ns
Dimensions in inches and (millimeters)
Polarity : Indicated by cathode band
ESD Rating of Class 3 (> 16 KV) per Human Body Model
Mounting Position : Any
IEC61000−4−2 Level 4 ESD Protection
Weight : Approximated 0.011 gram
These are Pb−Free Devices
MAXIMUM
available
Pb-Free package is
RATINGS AND ELECTRICAL CHARACTERISTICS
0.040(1.0)
 
Ratings at 25℃ ambient temperature
code suffix ”G”
RoHS product for packing
unless otherwise specified.
Single phase half wave, 60Hz, resistive of inductive load.
Halogen free product for packing code suffix “H”
For capacitive load, derate current by 20%
RATINGS
Marking Code
SYMBOL
FM120-M
H FM130-MH
FM140-MH FM150-MH FM160-MH FM180-MH FM1100-MH FM1150-MH FM1200-MH
U
Maximum Ratings @Ta=25℃
Maximum RMS Voltage
Maximum DC Blocking Voltage
 
Maximum Recurrent Peak Reverse Voltage
V
RRM
V
RMS
V
DC
I
O
12
20
14
20
13
30
21
30
14
40
28
40
15
50
16
60
42
60
18
80
10
100
115
150
105
150
120
200
140
200
V
Parameter
Symbol
50
35
Limit
56
80
Unit
70
V
100
V
Maximum Average Forward
IEC61000−4−2(ESD)
Rectified Current
Peak
Voltage
ESD
Forward Surge Current 8.3 ms single half sine-wave
Per
superimposed on rated load (JEDEC method)
Contact
 
Human
I
FSM
Typical Thermal Resistance (Note 2)
Operating Temperature Range
R
ΘJA
T
J
Body Model
Per Machine Model
 
1.0
±30
 
30
16
KV
KV
A
 
A
Total Power Dissipation on
1)
Typical Junction Capacitance (Note
FR-5 Board (Note 1)
C
J
Thermal Resistance Junction−to−Ambient
TSTG
Storage Temperature Range
 
-55 to +125
P
D
R
ΘJA
40
100
120
400
 
V
mW
℃/W
 
 
-
65
to
1250
+175
-55 to +150
 
T
L
Lead Solder Temperature
Maximum (10 Second Duration)
FM140-MH FM150-MH FM160-MH
260
FM180-MH FM1100-MH
FM1150-MH
FM1200-MH
CHARACTERISTICS
SYMBOL
FM120-MH
FM130-MH
U
Junction and Storage Temperature Range
Maximum Average Reverse Current at @T A=25℃
 
Maximum Forward Voltage at 1.0A DC
V
F
I
R
0.50
T
j,
T
stg
0.70
-55 ~ +150
0.5
0.85
0.9
0.92
 
V
Stresses
DC Blocking Voltage
10
@T A=125℃
Rated
exceeding
maximum ratings
may damage the device. Maximum
ratings
are stress ratings only.
Functional operation above the
recommended.
Operating
conditions
is not implied. Extended exposure to
NOTES:
m
stresses above
1
the
recommended operating
4.0 VDC.
1- Measured at MHZ and applied reverse voltage of
conditions
may affect device reliability.
1.
2- Thermal
1.0 x 0.75
From Junction to Ambient
FR−5 =
Resistance
x 0.62 in.
 
 
2012-09
2012-06
WILLAS ELECTRONIC CORP.
WILLAS ELECTRONIC CORP