White Electronic Designs
Operating Temperature TA (ambient)
Commercial
Industrial
Storage Temperature
Commercial
Industrial
Voltage on any pin relative to V
SS
V
CC
supply Voltage relative to V
SS
PCMCIA Flash Memory Card
FLV Series
A
BSOLUTE
M
AXIMUM
R
ATINGS
(1)
0°C to +60 °C
-40°C to +85°C
-30°C to +80 °C
-40°C to +85°C
-0.5V to V
CC
+0.5V
-0.5V to +7.0V
Note:
Stress greater than those listed under Absolute Maximum Ratings may cause permanent damage to
the device. This is a stress rating only and functional operation at these or any other conditions
greater than those indicated in the operational sections of this specification is not implied. Exposure
to absolute maximum rating conditions for extended periods may affect reliability.
DC C
HARACTERISTICS
(1)
V
CC
= 3.3V/5V
Symbol
I
CCR
I
CCW
I
CCE
I
CCS
(CMOS)
Parameter
V
CC
Read Current
V
CC
Program Current
V
CC
Erase Current
V
CC
Standby Current
Density
(Mbytes)
All
All
All
2MB
20MB
4MB
40MB
28F008SC
28F016SC
28F008SC
28F016SC
Notes
3.3V V
CC
Typ
(3)
Max
10
12
60
40
5V V
CC
Typ
(3)
Max
20
35
75
50
60
420
60
420
230
230
Units
mA
mA
mA
µA
Test Conditions
V
CC
= V
CC
max
tcycle = 150ns, CMOS levels
2
2
50
400
50
400
200
200
V
CC
= V
CC
max
Control Signals = V
CC
Reset = V
SS
, CMOS levels
CMOS Test Conditions: V
CC
= 5V ± 5%, V
IL
= V
SS
± 0.2V, V
IH
= V
CC
± 0.2V
Notes:
1. All currents are RMS values unless otherwise specified. I
CCR
, I
CCW
and I
CCE
are based on Byte wide operations. For 16 bit operation values
are double.
2. Control Signals: CE
1
, CE
2
, OE, WE, REG.
3. Typical: V
CC
= 5V, T = +25°C.
Symbol
I
LI
I
LO
V
IL
V
IH
V
OL
V
OH
V
LKO
Parameter
Input Leakage Current
Output Leakage Current
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
V
CC
Erase/Program
Lock Voltage
Notes
1
1
1
1
1
1
1
Min
Max
±20
±20
Units
µA
µA
V
V
V
V
V
Test Conditions
V
CC
= V
CC
MAX
V
IN
=V
CC
or V
SS
V
CC
= V
CC
MAX
V
OUT
=V
CC
or V
SS
0
0.7xV
CC
V
CC
-0.4
2.0
0.8
V
CC
+0.5
0.4
V
CC
I
OL
= 3.2mA
I
OH
= -2.0mA
Notes:
1. Values are the same for byte and word wide modes for all card densities.
2. Exceptions: Leakage currents on CE
1
, CE
2
, OE, REG and WE will be < 500 µA when V
IN
= GND due to internal pull-up resistors.
Leakage currents on RST will be <150µA when V
IN
=V
CC
due to internal pull-down resistor.
5
White Electronic Designs Corporation (508) 485-4000 www.whiteedc.com
WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
