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5962-9461109HBA 参数 Datasheet PDF下载

5962-9461109HBA图片预览
型号: 5962-9461109HBA
PDF下载: 下载PDF文件 查看货源
内容描述: [SRAM Module, 512KX32, 20ns, CMOS, CQFP68, CERAMIC, QFP-68]
分类和应用: 静态存储器内存集成电路
文件页数/大小: 939 页 / 2407 K
品牌: WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
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MIL-HDBK-103AP
FOREWORD
1. This handbook is approved for use by all Departments and Agencies of the Department of Defense.
2. This handbook is for guidance only. This handbook cannot be cited as a requirement. If it is, the contractor does not have
to comply.
3. The proliferation of industry prepared drawings for the same part used in a variety of military applications has become an
ever increasing item of expense to the DoD. Numerous situations have arisen where one military acquisition document would
be more appropriate and cost effective than the multiplicity of contractor prepared drawings. Standard Microcircuit Drawings
(SMDs) are being prepared to eliminate the need for the multitude of contractor prepared drawings for the same device when
the minimum requirements of SMD's are sufficient to meet the requirements of the application on an interim or permanent
basis.
4. Comments, suggestions, or questions on this document should be addressed to: Commander, DLA Land and Maritime,
ATTN: VAS, 3990 East Broad St., Columbus, OH 43218-3990, or emailed to
Since contact information can
change, you may want to verify the currency of this address information using the ASSIST online database at
https://assist.dla.mil.
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