WS128K32-XXX
128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595
FEATURES
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Access Times of 15, 17, 20, 25, 35, 45, 55ns
MIL-STD-883 Compliant Devices Available
Packaging
66 pin, PGA Type, 1.075" square, Hermetic Ce
ramic HIP (Package 400)
Commercial, Industrial and Military Temperature
Ranges
5 Volt Power Supply
Low Power CMOS
TTL Compatible Inputs and Outputs
Built in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight:
WS128K32-XG1UX
1
- 5 grams typical
WS128K32-XG1TX - 5 grams typical
WS128K32-XG2UX - 8 grams typical
WS128K32-XG2LX - 8 grams typical
WS128K32-XH1X - 13 grams typical
WS128K32-XG4TX
1
- 20 grams typical
All devices are upgradeable to 512Kx32
68 lead, 40mm CQFP (G4T)
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, 3.56mm (0.140")
(Package 502)
68 lead, 22.4mm CQFP (G2U), 3.56mm (0.140"),
(Package 510)
68 lead, 22.4mm (0.880") square, CQFP (G2L),
5.08mm (0.200") high, (Package 528).
68 lead, 23.9mm Low Profile CQFP (G1U)
1
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3.57mm (0.140"), (Package 519)
68 lead, 23.9mm Low Profile CQFP (G1T), 4.06
mm (0.160"), (Package 524)
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Organized as 128Kx32; User Configurable as
256Kx16 or 512Kx8
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Note 1: Package Not Recommended For New Design
FIG. 1
P
IN
C
ONFIGURATION
F
OR
WS128K32N-XH1X
T
OP
V
IEW
P
IN
D
ESCRIPTION
I/O
0-31
Data Inputs/Outputs
A
0-16
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
B
LOCK
D
IAGRAM
May 2003 Rev. 12
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
