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5962-9461113HXA 参数 Datasheet PDF下载

5962-9461113HXA图片预览
型号: 5962-9461113HXA
PDF下载: 下载PDF文件 查看货源
内容描述: [SRAM Module, 512KX32, 35ns, CMOS, CPGA66,]
分类和应用: 静态存储器内存集成电路
文件页数/大小: 40 页 / 287 K
品牌: WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
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1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,
and E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
K
H
G
Device performance documentation
Highest reliability class available. This level is intended for use in space
applications.
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C, and D).
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
E
D
1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
A
B
M 3/
T
U
X
Y
9 3/
Descriptive designator
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
Terminals
68
68
68
66
66
66
68
68
Package style
Co-fired ceramic, quad flatpack, single cavity
Ceramic, quad flatpack, single cavity
Co-fired ceramic, single/dual cavity, quad flatpack
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, with standoffs
Hex-in-line, single cavity, with standoffs
Ceramic, quad flatpack, single cavity
Ceramic, quad flatpack, single cavity
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
3/
Due to the short leads of case outlines M (single cavity) and case outline 9, caution should be taken if the system
application is to be used where extreme thermal transitions can occur. Case outline A can be used if longer leads are
necessary.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
R
5962-94611
SHEET
3
DSCC FORM 2234
APR 97