White Electronic Designs
512Kx32 SRAM MODULE, SMD 5962-94611
FEATURES
■
Access Times of 70, 85, 100, 120ns
■
Packaging
66 pin, PGA (H)
1
Type, 1.185 inch square,
Hermetic Ceramic HIP (Package 401).
68 lead, Hermetic CQFP (G2T)
1
, 22.4mm
(0.880 inch) square. 4.57mm (0.180 inch) high
(Package 509)
■
Organized as 512Kx32, User Configurable as
1Mx16 or 2Mx8
■
Commercial, Industrial and Military Temperature
Ranges
■
TTL Compatible Inputs and Outputs
■
5 Volt Power Supply
■
Low Power CMOS
WS512K32-XXX
■
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
■
Weight
WS512K32-XG2TX
1
- 8 grams typical
WS512K32N-XHX
1
- 13 grams typical
* This data sheet describes a product that is subject to change
without notice.
Note 1: Package Not Recommended for New Designs.
FIG. 1
1
I/O
8
I/O
9
I/O
10
A
13
A
14
A
15
A
16
A
17
I/O
0
I/O
1
I/O
2
11
PIN CONFIGURATION FOR WS512K32N-XHX
T
OP
V
IEW
12
WE
2
CS
2
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
NC
I/O
3
22
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE
A
18
WE
1
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
WE
4
I/O
27
A
3
A
4
A
5
WE
3
CS
3
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
I/O
22
I/O
21
I/O
20
8
8
8
8
56
P
IN
D
ESCRIPTION
I/O
0-31
Data Inputs/Outputs
A
0-18
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
B
LOCK
D
IAGRAM
W E
1
CS
1
OE
A
0
-
18
512K x 8
512K x 8
512K x 8
512K x 8
W E
2
CS
2
W E
3
CS
3
W E
4
CS
4
66
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
June 2003 Rev. 3
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WEDC [ WHITE ELECTRONIC DESIGNS CORPORATION ]
