VITESSE
SEMICONDUCTOR CORPORATION
Data Sheet
VSC830
Package Thermal Characteristics
2.7Gb/s Asynchronous
Dual 2x2 Crosspoint Switch
The VSC830 is packaged into a standard plastic quad flatpack with an embedded, but unexposed thermal
slug. This package adheres to industry-standard EIAJ footprints for a 10x10mm body, 44 lead PQFP. The pack-
age construction is as shown in Figure 4. The 44-pin PQFP with embedded slug has the thermal properties
shown in Table 11. This package allows the VSC830 to operate with ambient temperatures up to 70
o
C in still
air.
Figure 4: Package Cross Reference
Wire Bond
Die
Plastic Molding Compound
Lead
Insulator
Copper Heat Spreader
Table 11: 44-Pin PQFP Thermal Resistance
Symbol
θ
CA-0
θ
CA-100
θ
CA-200
θ
CA-400
θ
CA-600
Description
Thermal resistance from case-to-ambient, still air
Thermal resistance from case-to-ambient, 100 LFPM air
Thermal resistance from case-to-ambient, 200 LFPM air
Thermal resistance from case-to-ambient, 400 LFPM air
Thermal resistance from case-to-ambient, 600 LFPM air
Value
( C/W)
o
T
A(MAX)
(
o
C)
50.9
57.8
61.1
65.6
68.3
28.4
22.7
19.9
16.2
13.9
NOTE: T
A(MAX)
= max case temperature - (max power dissipation •
θ
CA AIRFLOW
).
G52192-0, Rev 4.0
05/23/01
©
VITESSE
SEMICONDUCTOR CORPORATION
• 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com
Internet: www.vitesse.com
Page 9
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