VSC8101/8102
VITESSE
155.52 Mb/s Clock and
Data Recovery Units
Preliminary Data Sheet
Thermal Characteristics of the VSC8101 and VSC8102 Packages
VSC8101
The VSC8101 is packaged in a 28PLCC, with an internal heat spreader for improved heat dissipation. With
natural convection, the Case to Air Thermal Resistance (θ CA)is estimated to be 65oC/W.
VSC8102
The VSC8102 is packaged in a thermally enhanced 100PQFP with an embedded heat spreader. The heat
spreader surface area is shown in figure 9. With natural convection, the Case to Air Thermal Resistance (θ CA)is
estimated to be 27.5oC/W. The Air Flow versus Thermal Resistance relationship is shown in the following
table:
θ
Table 6:
Versus Air Velocity for the VSC8102 Package
CA
o
Air Velocity (LFPM)
Case to Air Thermal Resistance ( C/W)
0
27.5
23.1
19.8
17.6
16
100
200
400
600
G52087-0 Rev. 1.3
® VITESSE Semiconductor Corporation
Page 13
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
