VITESSE
SEMICONDUCTOR CORPORATION
Data Sheet
2.5Gb/s 16-Bit
Multiplexer/Demultiplexer Chipset
VSC8061/VSC8062
Package Information
52-Pin Ceramic LDCC (F) Package
B
A
I
J
K
L
C
HEAT SINK SIDE
D
PACKAGE IS
CAVITY DOWN
M
52
1
NOTES:
45o
Drawing not to scale.
E
All units in mm unless otherwise noted.
Packages: Ceramic (alumnia)
Heat Sinks: Copper tungsten
Leads: Alloy 42 with gold plating
N
O
Item
mm (Min/Max)
in (Min/Max)
Item
mm (Min/Max)
in (Min/Max)
A
B
C(1)
D(1)
E
18.54/19.56
1.02/1.52
0.730/0.770
0.040/0.060
0.610/0.650
0.600 TYP
0.050 TYP
I
J
0.41/0.61
2.03/2.79
0.09/0.24
4.57/5.34
27.69/30.22
0.36/0.56
1.75/1.90
0.016/0.024
0.080/0.110
0.003/0.009
0.180/0.210
1.090/1.190
0.014/0.022
0.069/0.075
15.49/16.51
15.24 TYP
1.27 TYP
K(1)
L
M
N
O
NOTE: (1) At package body.
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com
Internet: www.vitesse.com
Page 14
G52069-0, Rev 4.3
05/11/01