VITESSE
SEMICONDUCTOR CORPORATION
Data Sheet
2.5Gb/s SONET-Compatible
8-Bit MUX/DEMUX Chipset
VSC8021/VSC8022
Package Information
52-Pin Leaded
Ceramic Package (LDCC)
B
D
HEAT SINK SIDE
PACKAGE IS
CAVITY DOWN
52
1
45°
E
N
O
I
J
A
C
NOTES:
K
L
Drawing not to scale.
Packages: Ceramic (alumina);
Heat sink: Copper-tungsten;
Leads: Alloy 42 with gold plating.
M
Item
mm (Min/Max)
in (Min/Max)
Item
mm (Min/Max)
in (Min/Max)
A
B
C(1)
D(1)
E
18.54/19. 56
1.02/1.52
0.730/0.770
0.040/0.060
0.610/0.650
0.600 TYP
0.050 TYP
0.030/0.040
0.667 TYP
0.075/0.095
I
J
0.41/0.61
2.03/2.79
0.09/0.24
4.57/5.34
27.69/30.22
0.36/0.56
1.75/1.90
—
0.016/0.024
0.080/0.110
0.003/0.009
0.180/0.210
1.090/1.190
0.014/0.022
0.069/0.075
—
15.49/16.51
15.24 TYP
1.27 TYP
0.76/1.02
K(1)
L
M
N
F
G
16.94 TYP
1.91/2.41
O
H
—
NOTE: (1) At package body.
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com
Internet: www.vitesse.com
Page 16
G52028-0, Rev 4.1
05/25/01
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
