VSC7959
Data Sheet
BARE DIE AND PACKAGE INFORMATION
1597µm (0.0629")
Pad1
CZ1
Pad 16
NC
Pad 2
CZ2
Pad 15
SQUELCH
Pad 3
GND
Pad 14
VCC
Pad 4
IN+
Pad 13
OUT
VSC7959
1597µm
1440µm
Pad 5
IN−
Pad 12
OUT−
(0.0629")
(0.0567")
Pad 6
GND
Pad 11
VCC
Pad 7
LEVEL
Pad 10
LOS
Pad 8
TH
Pad 9
LOS
1440µm (0.0567")
Die Size Including Scribe:
1597µm x 1597µm (0.0629" x 0.0629")
Die Size Not Including Scribe: 1440µm x 1440µm (0.0567 x 0.0567")
Pad Pitch:
180µm (0.0071")
Pad Passivation Opening:
Die Thickness:
95µm x 95µm (0.0037" x 0.0037")
280µm (0.011")
The back side of the die may either be left floating or connected
to the most negative potential.
Figure 3. Pad Diagram for Bare Die (-W)
8 of 14
G52358, Rev 4.0
2/10/03
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
