VITESSE
SEMICONDUCTOR CORPORATION
Preliminary Data Sheet
SONET/SDH 2.5Gb/s Laser Diode Driver
VSC7927
Figure 8: Pad Assignments for VSC7927 Die
1720µm
1620µm
50µm
50µm
PAD 34 PAD 33 PAD 32 PAD 31 PAD 30 PAD 29 PAD 28 PAD 27 PAD 26
120
DCC
VSS
VSS
VSS
VSS
VIP
MIP
MIP
MIB
PAD 25
VIB
PAD 1
N/C
120µm
150µm
PAD 24
GND
PAD 2
NDIN
PAD 23
IOUT
PAD 3
DIN
30µm
PAD 22
IOUT
PAD 4
DINT
1620µm
1720µm
PAD 21
GND
PAD 5
CLOCKT
PAD 20
GND
PAD 6
CLOCK
PAD 7
NCLOCK
PAD 19
NIOUT
PAD 8
N/C
PAD 18
IBIAS
SEL
GND
GND
GND
GND
GND
GND NMARK MARK
PAD 9 PAD 10 PAD 11 PAD 12 PAD 13 PAD 14 PAD 15 PAD 16 PAD 17
Die Size:
1620µm x 1620µm
Actual Die Size: 1720µmx1720µm (after the die are cut up)
Pad Size:
Pad Pitch:
Space
120µm x 120µm
150µm
Between Pads: 30µm
© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012
Page 8
G52201-0, Rev 3.0
04/05/01/01
Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com
Internet: www.vitesse.com
VITESSE [ VITESSE SEMICONDUCTOR CORPORATION ]
